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US 12,112,875 B2Granted
Integrated circuit
AssigneeRealtek Semiconductor Corp.
InventorsHsiao-Tsung Yen, Ka-Un Chan
Life of this patent
Estimating the term…
Abstract
An integrated circuit includes a first coil and a second coil. The first coil is disposed on the first side of the integrated circuit. The second coil is disposed on the second side of the integrated circuit, and is partially overlapped with the first coil at a junction. The first coil is not interlaced with the second coil at the junction.
Claims18
An integrated circuit, comprising:
- a first coil disposed on a first side of the integrated circuit and comprising a first circle and a second circle;
- and
- a second coil disposed on a second side of the integrated circuit, comprising a third circle and a fourth circle, and is partially overlapped with the first coil at a junction;
- wherein the first coil is not interlaced with the second coil at the junction,
- wherein the first circle and the third circle are located on a first metal layer, and the second circle and the fourth circle are located on a second metal layer,
- wherein an end of a first portion of the second circle and an end of a first portion of the fourth circle form a first input and output terminal on the second metal layer, and an end of a second portion of the second circle and an end of a second portion of the fourth circle form a second input and output terminal on the second metal layer.
3 more elements
Dependencies are inferred from the claim text.