Signal routing between memory die and logic die for mode based operations

An apparatus, comprising:

• a memory die;
• a logic die bonded to the memory die via a wafer-to-wafer bonding process;
• wherein the logic die comprises a plurality of vector-vector (VV) units configured to:
• receive signals indicative of kernel data from a global data bus (GBUS) of the memory die and through a bond of the logic die and the memory die;
• receive signals indicative of input data from local input/output (LIO) lines of the memory die and through the bond;
• perform a plurality of operations using the signals indicative of kernel data and the signals indicative of input data;
• and
• provide a plurality of results of the plurality of operations to the LIO lines of the memory die based on a mode of the logic die utilizing a plurality of multiplexors (MUXs).

An apparatus, comprising:

• a memory die;
• a logic die bonded to the memory die via a wafer-to-wafer bonding process;
• wherein the logic die comprises a plurality of vector-vector (VV) units configured to:
• receive signals, at a buffer, indicative of first data from a global data bus (GBUS) of the memory die and through bond of the logic die and the memory die;
• receive signals, at the plurality of VV units, indicative of second data from local input/output (LIO) lines of the memory die and through the bond;
• perform a first plurality of operations using the signals indicative of the first data and the signals indicative of the second data to generate a plurality of outputs;
• store the plurality of outputs to the buffer based on the logic die being in a first mode;
• and
• provide the plurality of outputs to the memory die via the LIO lines based on the logic die being in a second mode.

A method comprising:

• storing, at a buffer of a logic die that is bonded to a memory die via a wafer-on-wafer bonding process, signals indicative of input data from a global data bus of the memory die and through a bond of the logic die and the memory die;
• receiving, at the logic die, signals indicative of kernel data from local input/output (LIO) lines of the memory die and through the bond;
• performing, at the logic die, a plurality of operations at a plurality of vector-vector (VV) units utilizing the signals indicative of input data and the signals indicative of kernel data;
• providing results of the plurality of operations to the buffer based on a mode of the logic die;
• and
• providing the results from the buffer to the memory die via the bond.

A method comprising:

• storing, at a buffer of a logic die that is bonded to a memory die via a wafer-on-wafer bonding process, signals indicative of input data from a global data bus of the memory die and through a bond of the logic die and the memory die;
• receiving, at the logic die, signals indicative of kernel data from local input/output (LIO) lines of the memory die and through the bond;
• performing, at the logic die, a plurality of operations at a plurality of vector-vector (VV) units utilizing the signals indicative of input data and the signals indicative of kernel data, wherein each of the plurality of VV units receives the signals indicative of the input data from the buffer concurrently;
• providing results of the plurality of operations to the buffer based on a mode of the logic die.

A method comprising:

• storing, at a buffer of a logic die that is bonded to a memory die via a wafer-on-wafer bonding process, signals indicative of input data from a global data bus of the memory die and through a bond of the logic die and the memory die;
• receiving, at the logic die, signals indicative of kernel data from local input/output (LIO) lines of the memory die and through the bond;
• performing, at the logic die, a plurality of operations at a plurality of vector-vector (VV) units utilizing the signals indicative of input data and the signals indicative of kernel data, wherein the input data comprises a quantity of bits that is less than or equal to a different quantity of bits that comprises the kernel data;
• providing results of the plurality of operations to the buffer based on a mode of the logic die.

A method comprising:

• storing, at a buffer of a logic die that is bonded to a memory die via a wafer-on-wafer bonding process, signals indicative of input data from a global data bus of the memory die and through a bond of the logic die and the memory die;
• receiving, at the logic die, signals indicative of kernel data from local input/output (LIO) lines of the memory die and through the bond;
• performing, at the logic die, a plurality of operations at a plurality of vector-vector (VV) units utilizing the signals indicative of input data and the signals indicative of kernel data, wherein the input data comprises a same quantity of bits as each of a number of portions of the kernel data;
• providing results of the plurality of operations to the buffer based on a mode of the logic die.