Electronic devices with displays and interposer structures

An electronic device comprising:

• a silicon substrate;
• an array of display pixels formed on the silicon substrate;
• a rigid printed circuit board;
• a flexible printed circuit that is attached to the rigid printed circuit board;
• a display driver integrated circuit that is configured to provide data to the array of display pixels, wherein the display driver integrated circuit bridges a gap between the flexible printed circuit and the silicon substrate, wherein a first portion of the display driver integrated circuit is attached to the flexible printed circuit, and wherein a second portion of the display driver integrated circuit is attached to the silicon substrate;
• a support structure that supports the silicon substrate and is overlapped by the silicon substrate, wherein the support structure has an extension that extends past an edge of the silicon substrate and is not overlapped by the silicon substrate;
• and
• a spacer interposed between the extension and the display driver integrated circuit.

An electronic device comprising:

• a silicon substrate;
• an array of display pixels formed on the silicon substrate;
• a silicon interposer having a first contact that is bonded to a respective second contact in the silicon substrate, wherein the silicon interposer has opposing first and second surfaces;
• a display driver integrated circuit having a third contact that is bonded to a respective fourth contact in the silicon interposer, wherein the first contact and the fourth contact are located on the first surface of the silicon interposer and wherein the display driver integrated circuit is configured to provide data to the array of display pixels through the silicon interposer;
• a flexible printed circuit having a fifth contact that is bonded to a respective sixth contact in the silicon interposer;
• and
• a rigid printed circuit board having a seventh contact that is bonded to a respective eighth contact in the flexible printed circuit, wherein the flexible printed circuit is interposed between the first surface of the silicon interposer and the rigid printed circuit board in a direction perpendicular to the first surface of the silicon interposer.