Complementary die-to-die interface

A method, comprising:

• sending, by a first instance of a particular integrated circuit design to a second instance of the particular integrated circuit design, first data via a set of transmit pins of a die-to-die interface;
• and
• receiving, by the first instance of the particular integrated circuit design from the second instance of the particular integrated circuit design, second data via a set of receive pins of the die-to-die interface, wherein the set of transmit pins and the set of receive pins are located in complementary positions relative to an axis of symmetry of the particular integrated circuit design;
• and
• wherein the die-to-die interfaces of the first and second instances of the particular integrated circuit design are coupled such that conductive paths attached to transmit and receive pins on the first instance are attached, respectively, to receive and transmit pins on the second instance without crossing.

An apparatus comprising:

• a bus circuit configured to transfer given data among a plurality of functional circuits in a particular integrated circuit;
• and
• a die-to-die interface, included in the particular integrated circuit, coupled to the bus circuit and including a plurality of transmitter circuits coupled to a particular set of transmit pins and a plurality of receiver circuits coupled to a particular set of receive pins;
• wherein the particular set of transmit pins is arranged in a particular layout relative to an axis of symmetry of the die-to-die interface;
• wherein the particular set of receive pins is arranged in a complementary layout to the particular layout, relative to the axis of symmetry;
• and
• wherein the die-to-die interface is configured to transfer particular data between the bus circuit and a different integrated circuit that includes the die-to-die interface in a manner that is transparent to software executing on the apparatus.