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US 12,111,574 B2Granted
Resist composition, method of forming resist pattern, compound, and resin
AssigneeTokyo Ohka Kogyo Co., Ltd.
InventorTakuya Ikeda
Life of this patent
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Abstract
A resist composition containing a polymeric compound having a constitutional unit (a01) derived from a compound represented by General Formula (a0-1). In the formula, W01 represents a polymerizable group-containing group, Ra01 represents a linear or branched hydrocarbon group, and Ra02 and Ra03 each independently represents a hydrocarbon group which may have a substituent
Claims11
A resist composition which generates acid upon exposure and exhibits changed solubility in a developing solution under action of acid, the resist composition comprising:
- a resin component (A1) which exhibits changed solubility in a developing solution under action of acid,
- wherein the resin component (A1) has a constitutional unit (a01) derived from a compound represented by General Formula (a0-1):
- wherein W01 represents a polymerizable group-containing group, Ra01 represents a linear or branched hydrocarbon group, and Ra02 and Ra03 each independently represent a hydrocarbon group which may have a substituent.
A compound represented by General Formula (a0-1):
- wherein W01 represents a polymerizable group-containing group, Ra01 represents a linear or branched hydrocarbon group, and Ra02 and Ra03 each independently represents a hydrocarbon group which may have a substituent.
A resin comprising:
- a constitutional unit (a01) derived from a compound represented by General Formula (a0-1):
- wherein W01 represents a polymerizable group-containing group, Ra01 represents a linear or branched hydrocarbon group, and Ra02 and Ra03 each independently represents a hydrocarbon group which may have a substituent.
Dependencies are inferred from the claim text.