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US 12,111,497 B2Granted
Applying stress compensation for aligning a companion chip with a host chip
AssigneeCiena Corporation
InventorsRaphael Beaupré-Laflamme, Simon Savard
Life of this patent
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Abstract
A stress compensating pick-up tool for aligning a companion chip with a host chip includes a tool tip and an actuator. The tool tip holds the companion chip, and includes a first tip portion and a second tip portion. The actuator applies a force to the tool tip, wherein the force causes the first tip portion and the second tip portion to rotate in opposite directions with respect to one another to optically align a portion of the companion chip with a corresponding portion of the host chip.
Claims6
A method for applying stress compensation for aligning a companion chip with a host chip, the method comprising:
- performing an active alignment to finely align the companion chip with the host chip by
- receiving a feedback from the host chip on whether the companion chip is optically aligned with the host chip, and
- activating a pick-up tool to apply a stress compensation force to the companion chip to adjust a curvature of the companion chip until the companion chip is optically aligned with the host chip;
- and
- when the companion chip is optically aligned with the host chip, curing an adhesive to affix the companion chip to the host chip while the pick-up tool is actively applying the stress compensation force to the companion chip.
2 more elements
Dependencies are inferred from the claim text.