Crack detector units and the related semiconductor dies and methods

A semiconductor die, comprising:

• a first crack detector unit (CDU), comprising:
• a switching circuit configured to determine whether to enable the first CDU;
• a logic circuit electrically connected to the switching circuit;
• and
• a first pattern electrically connected to the switching circuit of the first CDU, the ground, and an operating voltage,
• wherein the first CDU determines whether a crack is in the semiconductor die, and
• wherein the semiconductor die is connected to a second semiconductor die, the second semiconductor die includes a second pattern, the first CDU determine whether a crack is in the first pattern, the second pattern, or a connection between the semiconductor die and the second semiconductor die.

A method of detecting a crack in a semiconductor die, comprising:

• setting the CDU to a normal mode, wherein no operating voltage is applied to a metal pattern of the CDU, and the metal pattern is disposed in the semiconductor die;
• setting the CDU to a crack detection mode, wherein the operating voltage is applied to the metal pattern of the CDU;
• and
• determining whether a crack is in the semiconductor die based on an output of the CDU,
• wherein the semiconductor die is connected to a second semiconductor die, the second semiconductor die includes a second metal pattern, and the method further comprising determining whether a crack is in the metal pattern, the second metal pattern, or a connection between the semiconductor die and the second semiconductor die.