Back to results
US 12,111,343 B2Granted
Coaxial probe
AssigneeXcerra Corporation
InventorsYukang Feng, Jason Mroczkowski, Marty Cavegn
Life of this patent
Estimating the term…
Abstract
An apparatus and method for the manufacturing and use in a semiconductor test system is disclosed. The apparatus includes a signal probe and a dielectric sleeve surrounding the signal probe. A method includes forming a mold to receive a component of a contactor assembly, inserting the component into the mold, and forming a dielectric sleeve in at least one of the one or more signal probe holes through an injection molding process. The component includes one or more signal probe holes.
Claims20
An apparatus comprising:
- a radio-frequency signal probe comprising a first contact structure configured to contact a device under test at a first side and a second contact structure configured to contact a test circuit at a second side opposite the first side;
- and
- a plurality of dielectric sleeves surrounding the radio-frequency signal probe, wherein the dielectric sleeves are separated from each other along a length of the radio frequency signal probe, the length of the radio frequency signal probe extending between the first and second sides.
An apparatus comprising:
- a contactor assembly having a signal probe hole;
- a radio-frequency signal probe comprising a first contact structure configured to contact a device under test at a first side and a second contact structure configured to contact a test circuit at a second side opposite the first side;
- and
- a dielectric sleeve located in the signal probe hole and surrounding the radio frequency signal probe,
- wherein the contactor assembly has no ground probe disposed therein.
2 more elements
An apparatus comprising:
- a contactor assembly having a signal probe hole;
- a dielectric sleeve located in the signal probe hole;
- and
- a radio frequency signal probe inserted into the dielectric sleeve, the radio frequency signal probe having a device under test contact and a test circuit contact, wherein the radio frequency signal probe has a return loss of less than between about minus 10 dB and about minus 30 dB between about 50 gigahertz and about 60 gigahertz.
1 more element
An apparatus comprising:
- a contactor assembly having a signal probe hole;
- a dielectric sleeve located in the signal probe hole;
- and
- a radio frequency signal probe inserted into the dielectric sleeve, the radio frequency signal probe having a device under test contact and a test circuit contact, wherein the radio frequency signal probe includes a plurality of radio frequency signal probes and each of the plurality of radio frequency signal probes exhibits a cross-talk value lower than about 35 dB below about 40 gigahertz and lower than about 25 dB between about 20 and 60 gigahertz.
1 more element
An apparatus comprising:
- a contactor assembly having a signal probe hole;
- a dielectric sleeve located in the signal probe hole;
- and
- a radio frequency signal probe inserted into the dielectric sleeve, the radio frequency signal probe having a device under test contact and a test circuit contact, wherein the radio frequency signal probe has an insertion loss of less than about 1.0 dB between about zero and about 60 GHz.
1 more element
A method comprising:
- forming a contactor having a signal probe hole, the signal probe hole including a plurality of dielectric sleeves located in the signal probe hole;
- inserting a radio-frequency probe into the dielectric sleeves such that the dielectric sleeves are separated from each other along a length of the radio frequency signal probe;
- and
- forming a first contact structure configured to contact a device under test at a first side of the radio-frequency signal probe and a second contact structure configured to contact a test circuit at a second side of the radio-frequency signal probe opposite the first side, the length of the radio frequency signal probe extending between the first and second sides.
1 more element
A method comprising:
- forming a contactor having a signal probe hole;
- forming a radio-frequency signal probe including a plurality of surrounding dielectric sleeves, wherein the dielectric sleeves are separated from each other along a length of the radio frequency signal probe;
- inserting the radio frequency signal probe into the signal probe hole;
- and
- forming a first contact structure configured to contact a device under test at a first side of the radio-frequency signal probe and a second contact structure configured to contact a test circuit at a second side of the radio-frequency signal probe opposite the first side, the length of the radio frequency signal probe extending between the first and second sides.
2 more elements
A method comprising:
- forming a mold to receive a component of a contactor assembly, the component including one or more signal probe holes;
- inserting the component into the mold;
- and
- forming a dielectric sleeve in at least one of the one or more signal probe holes through an injection molding process.
1 more element
Dependencies are inferred from the claim text.