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US 12,111,272 B2Granted
System for estimating the occurrence of defects, and computer-readable medium
AssigneeHitachi High-Tech Corporation
InventorHiroshi Fukuda
Life of this patent
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AssigneeHitachi High-Tech Corporation
InventorHiroshi Fukuda
Estimating the term…
The purpose of this invention is to estimate the occurrence of defects such as probability pattern defects, with a small number of inspection points. To achieve this purpose, the present invention proposes a system and a computer-readable medium. The system comprises: a step in which first data pertaining to the probability that the edge of a pattern determined on the basis of measurement data for a plurality of measurement points on a wafer is present at a first position is acquired or is generated; a step in which, if the edge is at the first position, second data pertaining to the probability that a film defect covers a region including the first position and a second position which is different to said first position is acquired or generated; and a step in which the probability of the defect occurring is predicted on the basis of the first data and the second data.
A non-transitory computer-readable medium that stores a program instruction executable on a computer system to implement a computer-executed method for estimating an occurrence probability of a defect of a wafer based on measurement data obtained by a measurement tool, wherein
A system for predicting an occurrence probability of a defect on a wafer from measurement data obtained by a measurement tool, the system comprising:
Dependencies are inferred from the claim text.