Die-cast fin with opening and cover

A frame for enclosing computing components, the frame comprising:

• a plurality of fins arranged in parallel;
• an opening;
• and
• a cover movable between a closed position and an open position to close or open the opening,
• wherein no fins are formed on the cover,
• wherein the plurality of fins are made of a first material and the cover is made of a second material that is different from the first material,
• wherein the first material comprises zinc, aluminum, or zinc-aluminum alloy, and
• wherein the second material comprises a synthetic polymer including plastics,
• wherein the plurality of fins include a receiving portion that is recessed with respect to a top surface of the plurality of fins such that a top of a fastener is positioned lower than the top surface of the plurality of fins when the fastener is received at the receiving portion.

A computing device comprising:

• a Printed Circuit Board Assembly (PCBA) on which a plurality of computing components are mounted;
• a memory module mounted on the PCBA;
• a die-cast fin covering the PCBA, the die-cast fin having a cover movable between an open position and a closed position, the cover covering an opening in the closed position, the memory module being accessible when the cover is in the open position;
• and
• a fastener passing through a through-hole of the cover and received by a receiving portion of the die-cast fin,
• wherein:
• the receiving portion is recessed with respect to a top surface of the die-cast fin such that a top of the fastener is positioned lower than the top surface of the die-cast fin when the fastener is received at the receiving portion;
• the cover comprises a pair of protrusions;
• the die-cast fin has a pair of corresponding receiving portions configured to receive the pair of protrusions;
• and
• the cover is configured to pivot about an axis of the pair of protrusions.