Back to results
US 12,111,114 B2Granted
Heat transfer element, method for forming the same and semiconductor structure comprising the same
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorsHung-Hsien Huang, Shin-Luh Tarng, Ian Hu, Chien-Neng Liao, Jui-Cheng Yu, Po-Cheng Huang
Life of this patent
Estimating the term…
Abstract
A heat transfer element, a method for manufacturing the same and a semiconductor structure including the same are provided. The heat transfer element includes a housing, a chamber, a dendritic layer and a working fluid. The chamber is defined by the housing. The dendritic layer is disposed on an inner surface of the housing. The working fluid is located within the chamber.
Claims8
A heat transfer element, comprising:
- a housing including an upper portion and a lower portion, the upper portion including a base and a side wall connected to the base, wherein the side wall contacts the lower portion;
- a chamber defined by the upper portion and the lower portion;
- a first dendritic layer disposed in the chamber and on an inner lateral surface of the side wall of the upper portion;
- a second dendritic layer disposed on an upper surface of the lower portion, and spaced apart from a bottom end surface of the first dendritic layer, wherein a space is collectively defined by the bottom end surface of the first dendritic layer and a lateral end surface of the second dendritic layer, and exposes an interface between the side wall of the upper portion and the lower portion, wherein the bottom end surface of the first dendritic layer at least partially non-overlaps the second dendritic layer vertically;
- and
- a hole penetrating a second side wall of the upper portion, wherein the bottom end surface of the first dendritic layer overlaps the hole horizontally.
3 more elements
A heat transfer element. comprising:
- a housing including an upper portion and a lower portion, the upper portion including a base and a side wall connected to the base, wherein the side wall contacts the lower portion, wherein the upper portion further comprises an extension extending from the side wall;
- a chamber defined by the upper portion and the lower portion;
- a first dendritic layer disposed in the chamber and on an inner lateral surface of the side wall of the upper portion;
- a second dendritic layer disposed on an upper surface of the lower portion, and spaced apart from a bottom end surface of the first dendritic layer, wherein a space is collectively defined by the bottom end surface of the first dendritic layer and a lateral end surface of the second dendritic layer, and exposes an interface between the side wall of the upper portion and the lower portion;
- and
- a sealant bonding the extension of the upper portion to the lower portion, wherein the sealant laterally overlaps the space,
- wherein the second dendritic layer includes an upper portion non-overlapping the sealant horizontally, and a lower portion overlapping the sealant horizontally.
4 more elements
Dependencies are inferred from the claim text.