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US 12,110,425 B2Granted
Electromagnetic curable novel toughened epoxy-hybrid structural adhesives and applications using the same
AssigneeUniseal, Inc.
InventorsThanikaivelan Tindivanam Veeraraghavan, Ramanathan Lakshminarayan
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Abstract
One-component electromagnetic curable novel toughened epoxy-hybrid structural adhesives, generally including: (a) a bisphenol A liquid epoxy resin, (b) a bisphenol F liquid epoxy resin, (c) a bisphenol A solid epoxy resin, (d) a novel toughening agent, (e) one or more mineral fillers, and (f) a curing agent. The structural adhesives of the present invention can be cured within seconds and are useful for a plurality of applications, including bonding OEM closure panel components, such as doors, hoods, fenders, etcetera.
Claims2
A vehicle component assembly, comprising:
- a first substrate having a first surface and a second surface, wherein the first substrate comprises a first material and includes a thickness ranging from approximately 0.25 mm to approximately 5.00 mm;
- a second substrate having a first surface and a second surface, wherein the second substrate comprises a second material and includes a thickness ranging from approximately 0.25 mm to approximately 5.00 mm;
- wherein the first and second substrates comprise dissimilar materials;
- a one-component structural adhesive, comprising:
- a bisphenol A liquid epoxy resin;
- a bisphenol F liquid epoxy resin;
- a bisphenol A solid epoxy resin;
- a toughening agent, wherein the toughening agent comprises an epoxy terminated polyurethane interpenetrating network represented by the following chemical structure:
- A1-R1-A2
- wherein A1 is represented by the following chemical structure:
- wherein R1 comprises an alkyl, alkenyl, and/or alkynyl group containing approximately 1 to approximately 36 carbon atoms, an oligomer, and/or a urethane polymer;
- and wherein A2=A1;
- a three-component filler, wherein the three-component filler consists of fumed silica, carbon black, and calcium metasilicate;
- a three-component curing agent system, wherein the three-component curing system consists of dicyandiamide, 1-phenyl-3,3 dimethyl urea, and 2,4 toluene bis dimethyl urea;
- and
- wherein the structural adhesive is able to be fully electromagnetically cured at 190° C./4 sec;
- and
- wherein the one-component structural adhesive contacts and is positioned between the second surface of the first substrate and the first surface of the second substrate.
15 more elements
A one-component structural adhesive, comprising:
- a bisphenol A liquid epoxy resin, wherein the bisphenol A liquid epoxy resin comprises a diglycidyl ether of bisphenol A, and wherein the bisphenol A liquid epoxy resin is present from approximately 30 percent to approximately 50 percent by weight of the structural adhesive;
- a bisphenol F liquid epoxy resin, wherein the bisphenol F liquid epoxy resin comprises a diglycidyl ether of bisphenol F, and wherein the bisphenol F liquid epoxy resin is present from approximately 40 percent to approximately 60 percent by weight of the structural adhesive;
- a bisphenol A solid epoxy resin, wherein the bisphenol A solid epoxy resin comprises a bisphenol A unmodified solid epoxy resin, and wherein the bisphenol A solid epoxy resin is present from approximately 5 percent to approximately 15 percent by weight of the structural adhesive;
- a toughening agent, wherein the toughening agent comprises an epoxy terminated polyurethane interpenetrating network represented by the following chemical structure:
- A1-R1-A2
- wherein A1 is represented by the following chemical structure:
- wherein R1 comprises an alkyl, alkenyl, and/or alkynyl group containing approximately 1 to approximately 36 carbon atoms, an oligomer, and/or a urethane polymer;
- and wherein A2=A1, and wherein the toughening agent is present from approximately 5 percent to approximately 15 percent by weight of the structural adhesive;
- a three-component filler, wherein the three-component filler consists of fumed silica, carbon black, and calcium metasilicate, and wherein the three-component filler is present from approximately 2 percent to approximately 10 percent by weight of the structural adhesive;
- a three-component curing system, wherein the three-component curing system consists of dicyandiamide, 1-phenyl-3,3 dimethyl urea, and 2,4 toluene bis dimethyl urea, and wherein the three-component curing system is present from approximately 6 percent to approximately 10 percent by weight of the structural adhesive;
- and
- wherein the structural adhesive is electromagnetically curable.
9 more elements
Dependencies are inferred from the claim text.