Polypropylene-based adhesive and method for producing same
AssigneeIdemitsu Kosan Co., Ltd.
InventorsNozomu Fujii, Masami Kanamaru, Takuji Okamoto
Life of this patent
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Abstract
A polypropylene-based adhesive containing a polypropylene-based resin (A′) prepared by reducing the weight-average molecular weight of a polypropylene-based resin (A) by decomposition, in which the melting endotherm (ΔH-D) of the polypropylene-based resin (A) is 0 J/g or more and 80 J/g or less, as obtained from a melting endothermic curve drawn by holding a sample at −10° C. for 5 minutes in a nitrogen atmosphere followed by heating it at 10° C./min using a differential scanning calorimeter (DSC).
Claims12
A polypropylene-based adhesive, comprising:
- a polypropylene-based resin (A′) prepared by reducing a weight-average molecular weight of a polypropylene-based resin (A) by decomposition, in which a melting endotherm (ΔH-D) of the polypropylene-based resin (A) is 5 J/g or more and 80 J/g or less, as obtained from a melting endothermic curve drawn by holding a sample at −10° C. for 5 minutes in a nitrogen atmosphere followed by heating the sample at 10° C./min using a differential scanning calorimeter (DSC),
- wherein
- the polypropylene-based resin (A′) has a vinylidene group as a terminal unsaturated group contained per molecule of the polypropylene-based resin (A′) of 0.9 or more and 2.0 or less,
- the polypropylene-based resin (A) has a melting point (Tm-D) of 20° C. or higher and 120° C. or lower, and
- the polypropylene-based adhesive comprises a radical generator (B) in an amount of 0.01 parts by mass or more and 5 parts by mass or less relative to 100 parts by mass of the polypropylene-based resin (A).
A method for producing a polypropylene-based adhesive, the method comprising:
- reducing a weight-average molecular weight of a polypropylene-based resin (A);
- and
- decomposing the polypropylene-based resin (A) in the presence of a radical generator (B), thereby producing a polypropylene-based resin (A′),
- wherein
- a melting endotherm (ΔHm-D) of the polypropylene-based resin (A) is 5 Jig or more and 80 J/g or less, as obtained from a melting endothermic curve drawn by holding a sample at −10° C. for 5 minutes in a nitrogen atmosphere followed by heating the sample at 10° C./min using a differential scanning calorimeter (DSC),
- the polypropylene-based resin (A) has a melting point (Tm-D) of 20° C. or higher and 120° C. or lower,
- the polypropylene-based adhesive comprises a radical generator (B) in an amount of 0.01 parts by mass or more and 5 parts by mass or less relative to 100 parts by mass of the polypropylene-based resin (A), and
- the polpropylene-based resin (A′) has a vinylidene group as a terminal unsaturated group contained per molecule of the polypropylene-based resin (A′) of 0.9 or more and 2.0 or less.
Dependencies are inferred from the claim text.