Resins for use as tie layer in multilayer structure and multilayer structures comprising the same

Abstract

The disclosure relates to a tie resin formulation for use as a tie layer in a multilayer structure. The resin includes a first polyolefin grafted with an ethylenically unsaturated carboxylic acid, an ethylenically unsaturated acid derivative or a combination thereof, and having a density of 0.857 to 0.885 g/cm3, and 0.001 to 0.20 weight percent (wt. %) of a catalyst comprising at least one Lewis acid, where the resin includes the catalyst and up to 99.999 wt. % of the first polyolefin, where the wt. % is based on a total weight of the resin.

Dependencies are inferred from the claim text.