Back to results
US 12,110,356 B2Granted
Heat-curable resin composition
AssigneeShin-Etsu Chemical Co., Ltd.
InventorsNaoyuki Kushihara, Rina Sasahara
Life of this patent
Estimating the term…
Abstract
Provided is a heat-curable resin composition capable of being turned into a cured product having a low relative permittivity, a low dielectric tangent, an excellent adhesiveness and a high resistance. The heat-curable resin composition contains: (A) a citraconimide compound; (B) an epoxy resin; (C) an epoxy resin curing agent; and (D) a curing accelerator.
Claims15
A heat-curable resin composition comprising:
- one or more of each of
- (A) a citraconimide compound;
- (B) an epoxy resin;
- (C) an epoxy resin curing agent;
- and
- (D) a curing accelerator,
- wherein the epoxy resin curing agent (C) is at least one selected from an amine compound, a phenolic compound, an acid anhydride compound and an active ester compound.
4 more elements
A heat-curable resin composition consisting essentially of:
- one or more of each of
- (A) a citraconimide compound;
- (B) an epoxy resin;
- (C) an epoxy resin curing agent;
- (D) a curing accelerator;
- and
- optionally, one or more of an inorganic filler, a flame retardant, an ion trapping agent, an antioxidant, an adhesiveness imparting agent, a low stress agent and a colorant,
- wherein the epoxy resin curing agent (C) is at least one selected from an amine compound, a phenolic compound, an acid anhydride compound and an active ester compound.
5 more elements
Dependencies are inferred from the claim text.