Liquid ejecting head and liquid ejecting apparatus

A liquid ejecting head comprising:

• a nozzle substrate including
• a first nozzle configured to eject a liquid and
• a second nozzle provided at a position adjacent to the first nozzle and configured to eject a liquid;
• a pressure chamber substrate provided above the nozzle substrate and including
• a first pressure chamber that communicates with the first nozzle and
• a second pressure chamber that communicates with the second nozzle;
• a first piezoelectric element formed from a common electrode, a first piezoelectric body, and a first individual electrode and configured to apply a pressure to a liquid in the first pressure chamber;
• a second piezoelectric element formed from the common electrode, a second piezoelectric body, and a second individual electrode and configured to apply a pressure to a liquid in the second pressure chamber;
• a sealing substrate provided above the pressure chamber substrate in such a way as to cover the first piezoelectric element and the second piezoelectric element;
• a wiring board configured to apply a voltage to the common electrode, the first individual electrode, and the second individual electrode;
• a first wiring portion provided above the pressure chamber substrate and configured to electrically couple the common electrode to the wiring board;
• a second wiring portion provided at a lower surface of the sealing substrate and configured to electrically couple the common electrode to the wiring board;
• and
• a third wiring portion provided between the first piezoelectric element and the second piezoelectric element and configured to electrically couple the first wiring portion to the second wiring portion.