Substrate handling device and processing chamber

A substrate handling device comprising:

• a substrate reception area defined by an edge, the substrate reception area comprising:
• a planar surface, wherein the edge extends upward from the planar surface;
• and
• a plurality of contact structures extending upwards from the planar surface, wherein each of the plurality of contact structure has a patterned top surface, a first contact structure of the plurality of contact structures directly contacts a side surface of the edge, and a second contact structure of the plurality of contact structures is separated from the edge,
• the substrate reception area and the planar surface comprise a first material, and
• at least one contact structure of the plurality of contact structures comprises a second material different from the first material.

A processing chamber comprising:

• a substrate reception area, wherein the substrate reception area comprises a planar surface, and the substrate reception area comprises a first material;
• an edge surrounding at least a portion of the substrate reception area, wherein the edge protrudes perpendicular to the planar surface;
• a first contact structure directly contacting a side surface of the edge;
• a second contact structure separated from the edge, wherein a shape of the first contact structure is different from a shape of the second contact structure, the second contact structure comprises a second material different from the first material.