Semiconductor device manufacturing method, curable resin composition for temporary fixation material, film for temporary fixation material, and laminated film for temporary fixation material

A semiconductor device manufacturing method, the method comprising:

• preparing a first laminated body in which a supporting member, a conductor layer formed from a conductor that generates heat upon absorbing light, and a resin layer comprising a curable resin component are laminated in this order;
• disposing a semiconductor member on the support member via the conductor layer and the resin layer of the first laminated body;
• producing a second laminated body in which the support member, the conductor layer, a resin cured material layer comprising a cured product of the curable resin component, and the semiconductor member are laminated in this order, by curing the curable resin component in the resin layer of the first laminated body;
• and
• separating the semiconductor member from the supporting member by irradiating the conductor layer in the second laminated body with incoherent light,
• wherein the supporting member is a glass substrate.