Multi-modal sensor fusion platform
AssigneeInterlink Electronics, Inc.
InventorsChee Wai Lu, Wai Jye Chan, Kok Keong Law, Cheng Seong Lee
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AssigneeInterlink Electronics, Inc.
InventorsChee Wai Lu, Wai Jye Chan, Kok Keong Law, Cheng Seong Lee
Estimating the term…
A system may include a bottom layer and a sensing layer disposed on a first side of the bottom layer. The first sensing layer may include a first sensing element and a second sensing element. The first sensing element and the second sensing element may include one of: a force sensing element, a strain sensing element, a motion sensing element, or an environmental sensing element. The first sensing element and the second sensing element may be of a different type of sensing element. The system may also include a communications interface configured to couple the sensing layer with a host controller.
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Dependencies are inferred from the claim text.