Micro assembler with fine angle control
AssigneeXerox Corporation
InventorsJengPing Lu, Eugene M. Chow, David K. Biegelsen
Life of this patent
Estimating the term…
Abstract
First and second chiplets are positioned along a surface to respectively cover first and second electrodes. The first electrode is activated to cause an attraction force between the first electrode and the first chiplet. The second electrode is deactivated allowing the second chiplet to rotate on the surface. While the first electrode is activated and the second electrode is deactivated, a rotation field is applied to cause the second chiplet to be oriented at a desired orientation angle, the first chiplet being prevented from rotating by the attraction force.
Claims20
An apparatus, comprising:
- an assembly surface operable to receive objects, the assembly surface comprising an array of electrodes, each of the electrodes capable of being individually activated to apply a clamping force field to one of the objects;
- a field generator operable to apply a rotation field to the objects on the assembly surface, the rotation field orthogonal to the clamping force field;
- and
- a processor coupled to the field generator, the processor selectively activating the rotation field to selectively rotate the objects to different desired orientation angles.
A method, comprising:
- moving a plurality of objects onto an assembly surface, the assembly surface comprising an array of electrodes, each of the electrodes capable of being individually activated to apply a clamping force field to one of the objects;
- apply a rotation field to the objects on the surface via a field generator the rotation field orthogonal to the clamping force field;
- and
- selectively activating the rotation field to selectively rotate the objects to different desired orientation angles.
Dependencies are inferred from the claim text.