US 12,034,429 B2Granted

Saw device with improved thermal management

AssigneeRF360 Singapore Pte. Ltd.

InventorsKamran Cheema, Bambang Kunardi, Yu Jen Chong, Chong Choon Lee

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Abstract

This invention focuses on minimizing the hot spots on a filter chip by creating thermal radiators using the mechano-acoustic structures and connection circuitry. A gradual increase of metal to wafer relation is made to provide better heat dissipation and heat sinking. Preferably the shunt lines of the ladder type arrangement of SAW resonators (RS1, RS2, RS3) comprise a broadened section (BBCN). Each two series resonators (RS1, RS2, RS3) that are subsequent to each other in the series signal line are connected via a common busbar (BBCN) extending over a whole length of that subsequent series resonators, a lateral extension of the common busbars represents a first section of a respective shunt line each, each first shunt line section between a node and the parallel resonator (RP1, RP2) of a shunt line (SLS1) comprises a broadened section (BS) that is broader than the common busbar, the broadened section extends over the whole width of the parallel resonator (RP1), the first reflector (REF1) of the parallel resonator that faces the laterally adjacent series resonator is formed from the broadened section (BS).

Claims11

Dependent claims

A SAW filter device with a ladder type structure, comprising:

series resonators arranged in a series signal line;
respective shunt lines connected to respective nodes situated in the series signal line between two adjacent series resonators of the series resonators;
and
parallel resonators each being arranged in a respective shunt line of the shunt lines, each of the parallel resonators comprising a first reflector, wherein:
each of the parallel resonators has a length measured in a longitudinal direction and a width measured in a transversal direction,
each of the two adjacent series resonators are connected via a common busbar extending over a length of the two adjacent series resonators,
a lateral extension of each of the common busbar forms a first section of each of the respective shunt lines,
each of the respective shunt lines comprises a broadened section that is broader than the respective common busbar, the broadened section located between the respective common busbar and a corresponding parallel resonator of the parallel resonators,
the broadened section extends over the width of the corresponding parallel resonator, and
the first reflector of each of the parallel resonators is formed at least in part from the broadened section.

7 more elements

Dependencies are inferred from the claim text.

Facts

Application: 17/431,411Filed 24 Jan 2020
Priority: DE 10 2019 104 993.827 Feb 2019
Published: US 2022/0140807 A15 May 2022
Granted: 9 Jul 2024
Term ends: Not estimatedThe source records don’t support an estimate.

Classification7 codes

H03H 9/02834
Means for compensation or elimination of undesirable effects: of temperature influence
H03H 9/02992
Of surface acoustic wave devices: details of bus bars, contact pads or other electrical connections for finger electrodes
H03H 9/6483
Coupled resonator filters: ladder SAW filters
H03H 3/10
For the manufacture of resonators or networks using surface acoustic waves: for obtaining desired frequency or temperature coefficient

Family

US 2022/0140807 A1Pre-grant publication · published 5 May 2022
US 12,034,429 B2This patent

From the US filing history. Foreign family members aren’t listed.

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