Dual wafer plating fixture for a continuous plating line

A method of electroplating a plurality of substrates, the method comprising:

• mounting two substrates to be plated onto a wafer plating fixture, the wafer plating fixture comprising:
• an electrically conductive carrier bus;
• a plurality of contact clips electrically coupled to the electrically conductive carrier bus, wherein the plurality of contact clips are distributed on opposite sides of the carrier bus and configured to electrically couple the two substrates to the carrier bus, wherein each one of the plurality of contact clips is symmetric about the opposite sides of the electrically conductive carrier bus, and wherein each one of the plurality of contact clips comprises a conductive material having a non-conductive coating thereon;
• and
• a non-conductive substrate backer coupled to the electrically conductive carrier bus and configured to separate the two substrates, wherein the non-conductive substrate backer comprises a top portion that extends along a bottom edge portion of the electrically conductive carrier bus and two or more distal extensions that extend from the top portion of the non-conductive substrate backer, wherein the distal extensions are configured to keep the two substrates from contacting;
• mounting the wafer plating fixture on a continuous belt of a plating system;
• dipping the wafer plating fixture with the two substrates held thereon into an electroplating bath;
• and
• applying a voltage to the two substrates via the wafer plating fixture to simultaneously electroplate the two substrates.