Package comprising an integrated passive device configured as a cap for a filter

An apparatus comprising:

• means for acoustic filtering comprising:
• a substrate comprising a piezoelectric material;
• and
• at least one transducer coupled to and touching the piezoelectric material of the substrate;
• means for passive functionality coupled to the means for acoustic filtering, wherein the means for passive functionality is configured as a cap for the means for acoustic filtering, wherein the means for passive functionality includes a metal-insulator-metal (MIM) capacitor defined by a first interconnect, an insulation layer and a second interconnect;
• and
• a void located between the means for acoustic filtering and the means for passive functionality,
• wherein the first interconnect of the MIM capacitor of the means for passive functionality is exposed to the void located between the means for acoustic filtering and the means for passive functionality.

A method for fabricating a package, comprising:

• providing an integrated device configured as an acoustic filter, the integrated device comprising:
• a substrate comprising a piezoelectric material;
• and
• at least one metal layer coupled to a first surface of the substrate, wherein at least part of the at least one metal layer is configured as a transducer that touches the piezoelectric material of the substrate;
• and
• coupling an integrated passive device to the integrated device, wherein the integrated passive device is configured as a cap for the integrated device and includes a metal-insulator-metal (MIM) capacitor defined by a first interconnect, an insulation layer, and a second interconnect, wherein coupling the integrated passive device to the integrated device forms a void located between the integrated device and the integrated passive device where the first interconnect of the MIM capacitor is exposed to the void.