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US 12,016,187 B2Granted
Encapsulating composition
AssigneeLG Chem, Ltd.
InventorsJi Won Kwak, Joon Hyung Kim, Kook Hyun Choi, Mi Lim Yu, Yung Jong Lee
Life of this patent
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Abstract
The present application provides an encapsulating composition which can effectively block moisture or oxygen introduced into an organic electronic device from the outside, and has excellent spreadability, is applicable to thin organic electronic devices and has excellent hardness of the cured product after curing, without causing an inter-circuit interference problem.
Claims13
An encapsulating composition comprising an aliphatic carbobicycle compound having one or more functional groups;
- an epoxy compound having a cyclic structure in the molecular structure;
- a linear or branched aliphatic epoxy compound;
- and a compound having an oxetane group,
- wherein the aliphatic carbobicycle compound is included in a range of 1 part by weight to 50 parts by weight relative to 100 parts by weight of the encapsulating composition,
- the epoxy compound having a cyclic structure in the molecular structure is included in a range of 5 parts by weight to 150 parts by weight relative to 100 parts by weight of the aliphatic carbobicycle compound,
- the linear or branched aliphatic epoxy compound is included in a range of 20 parts by weight to 300 parts by weight relative to 100 parts by weight of the aliphatic carbobicycle compound, and
- the compound having an oxetane group is included in a range of 40 parts by weight to 800 parts by weight relative to 100 parts by weight of the aliphatic carbobicycle compound, and
- wherein the encapsulating composition has a viscosity of 50 cP or less as measured at room temperature.
5 more elements
Dependencies are inferred from the claim text.