Shield package

A shield package comprising:

• a package in which an electronic component is sealed with a sealing material;
• and
• a shield layer covering the package,
• wherein a surface of the shield layer includes a patterned portion and a non-patterned portion other than the patterned portion, and
• a ratio of Smr1 of the non-patterned portion to Smr1 of the patterned portion is as follows:
• (Smr1 of non-patterned portion)/(Smr1 of patterned portion)>1.0, where Smr1 represents a ratio of the area of the material at the intersection line which separates the protruding hills from the core surface to the evaluation area.

A shield package comprising:

• a package in which an electronic component is sealed with a sealing material;
• and
• a shield layer covering the package,
• wherein a surface of the shield layer includes a patterned portion and a non-patterned portion other than the patterned portion, and
• a ratio of Ssk of the non-patterned portion to Ssk of the patterned portion is as follows:
• (Ssk of non-patterned portion)/(Ssk of patterned portion)<5.0, where Ssk represents skewness.