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US 12,016,156 B2Granted
Mil-aero conduction cooling chassis
AssigneeThe Boeing Company
InventorsTaylor Brandon Hellar, George N. Theodorou
Life of this patent
Estimating the term…
Abstract
A heat frame and a processing device are provided. The heat frame includes a plurality of fins and at least one heat pipe extending through a hole provided in each of the plurality of fins. The heat frame is coupled to a cooling chassis. The processing device includes a processing module, a first heat frame, and a second heat frame.
Claims20
A heat frame for a processing device, comprising:
- a plurality of fins;
- and
- at least one heat pipe extending through a hole provided in each of the plurality of fins, wherein the heat frame is to extend from a processing module and is coupled to a cooling chassis, and wherein the cooling chassis includes at least one cooling wall extending perpendicularly from the heat frame between the plurality of fins and the processing module.
A processing device, comprising:
- a processing module;
- a first heat frame coupled to and extending from a first side of the processing module;
- and
- a second heat frame coupled to and extending from a second side of the processing module,
- wherein each of the first heat frame and the second heat frame is to couple to a cooling chassis, and wherein each of the first heat frame and the second heat frame comprises:
- a plurality of fins, each fin of the plurality of fins including at least one hole, wherein each fin of the plurality of fins is parallel to every other fin;
- and
- at least one heat pipe extending through the hole provided in each of the plurality of fins,
- wherein a portion of the cooling chassis is positioned between each of the plurality of fins and the processing module, and the portion of the cooling chassis extends perpendicular from each of the first heat frame and the second heat frame.
6 more elements
A conduction cooling chassis, comprising:
- a processing device, comprising:
- a first heat frame,
- a second heat frame,
- wherein each of the first heat frame and the second heat frame comprises a plurality of fins and at least one heat pipe coupled to the plurality of fins, and
- a processing module provided between the first heat frame and the second heat frame, wherein the first heat frame extends from a first side of the processing module and the second heat frame extends from a second side of the processing module;
- a first cooling chassis and a second cooling chassis, each of the first cooling chassis and the second cooling chassis comprising:
- a first wall,
- a second wall, and
- a slot provided between the first wall and the second wall, wherein a junction between the first heat frame and the processing module is provided in the slot of the first cooling chassis and a junction between the second heat frame and the processing module is provided in the slot of the second cooling chassis;
- wherein each of the first wall and the second wall of each of the first cooling chassis and the second cooling chassis extends perpendicular from each of the first heat frame and the second heat frame.
7 more elements
Dependencies are inferred from the claim text.