Heat sink with improved thermal conductivity
AssigneesContinental Automotive France, Continental Automotive GmbH
InventorPhilippe Lopez
Life of this patent
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Abstract
A heat sink including a first face in contact with electronic components generating heat to be removed and a second face in contact with the medium into which to dissipate the heat generated by the electronic components, including: at least one device for enhancing the thermal conductivity including a dome-shaped surface, a pin and a lateral section of revolution about the pin, the dome-shaped surface being connected to one end of a pin and to the lateral section of revolution, the dome-shaped surface being arranged on the second-face side, the free end of the pin being arranged on the first-face side.
Claims9
A heat sink comprising:
- a first face in contact with electronic components generating heat to be removed and a second face in contact with a medium into which to dissipate the heat generated by the electronic components,
- at least one device for enhancing a thermal conductivity comprising a dome-shaped surface, a pin and a lateral section surrounding the pin, the dome-shaped surface being connected to one end of the pin and to the lateral section, the dome-shaped surface having a round tip extending in a direction away from the first face,
- the dome-shaped surface being arranged on the second face, a free end of the pin being arranged on the first face,
- wherein the first face is a planar first face, and
- wherein the free end of the pin is on the planar first face, and a surface of the lateral section opposite the dome-shaped surface is arranged on the planar first face.
Dependencies are inferred from the claim text.