Electronic component with cooling clearance, and assembly method

A method for assembling an electronic component, comprising:

• providing a circuit carrier unit, an electronic element is assembled on the circuit carrier unit, the circuit carrier unit has a first section and a second section arranged at a distance from the first section and opposing the first section;
• providing a housing having a bottom, a first receiving portion and a second receiving portion separated from the first receiving portion wherein the housing defines a cover comprising both a cooling clearance having a closed end and an open end, and a side wall having at least one venting aperture through the side wall and in fluid communication with the cooling clearance and adjacent to the bottom;
• inserting the circuit carrier unit at least partly into the housing, the first section is received in the first receiving portion and the second section is received in the second receiving portion, and the electronic component is adjacent to the bottom;
• and
• affixing the cover element to enclose and seal the circuit carrier unit and electronic element in a watertight manner.

An electronic component, comprising:

• a circuit carrier unit having an electronic element;
• and
• a housing having a housing wall at least partly encompassing the circuit carrier unit, the housing having:
• a first receiving portion and a second receiving portion connected by a side wall and separated from each other by a cooling clearance extending from a proximal end adjacent the electronic element, toward a distal end open to an external environment thereby defining a heat dissipation axis, and
• at least one venting aperture extending through the side wall placed near the electronic element and away from the distal end, and configured to communicate between the cooling clearance and the external environment.