Circuit board with a conductive bump mounted on an adhesive layer
AssigneeUnimicron Technology Corp.
InventorsMing-Hao Wu, Hsuan-Wei Chen
Life of this patent
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Abstract
A circuit board and a method of manufacturing the same are provided. The method includes the following steps of providing a first conductive layer; providing an adhesive material and at least one conductive bump, in which the adhesive material is electrically conductive; adhering at least one conductive bump to a surface of the first conductive layer using the adhesive material; providing an insulation layer; disposing the insulation layer on the surface of the first conductive layer and at least one conductive bump; and disposing a second conductive layer on the insulation layer.
Claims16
A circuit board, comprising:
- a first conductive layer;
- at least one adhesive layer disposed on a surface of the first conductive layer, wherein the at least one adhesive layer is electrically conductive, and a material of the at least one adhesive layer comprises metal particles;
- at least one conductive bump comprising a top surface and a bottom surface opposite to the top surface, wherein the bottom surface is in contact with the at least one adhesive layer and is adhered on the first conductive layer via the at least one adhesive layer;
- an insulation layer covering the surface of the first conductive layer and the at least one conductive bump;
- a second conductive layer disposed on the insulation layer;
- and at least one conductive column penetrating the second conductive layer and the insulation layer and extending to the top surface of the at least one conductive bump.
A method of manufacturing circuit board, comprising steps of:
- providing a first conductive layer;
- providing an adhesive material and at least one conductive bump, wherein the adhesive material is electrically conductive and comprises metal particles;
- adhering the at least one conductive bump on a surface of the first conductive layer via the adhesive material;
- providing an insulation layer;
- disposing the insulation layer on the surface of the first conductive layer and the at least one conductive bump, comprising:
- removing a portion of the insulation layer to form at least one recess indented inward;
- covering and accommodating the at least one conductive bump in the at least one recess;
- and
- laminating the insulation layer, the at least one conductive bump and the first conductive layer;
- and
- disposing a second conductive layer on the insulation layer.
Dependencies are inferred from the claim text.