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US 12,016,128 B2Granted
Circuit board and method of manufacturing the same
AssigneeLG Innotek Co., Ltd.
InventorsMin Young Hwang, Byeong Kyun Choi, Jin Seok Lee, Moo Seong Kim
Life of this patent
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Abstract
A circuit board according to an embodiment includes an insulating layer; and a circuit pattern disposed on the insulating layer, wherein the circuit pattern includes a copper foil layer disposed on the insulating layer, a first plating layer disposed on the copper foil layer, and a second plating layer disposed on the first plating layer, and wherein the copper foil layer has a thickness in a range of 2 μm to 5 μm.
Claims16
A circuit board comprising:
- an insulating layer;
- a circuit pattern disposed on the insulating layer;
- and
- a via disposed in a via hole passing through the insulating layer,
- wherein the circuit pattern includes:
- a copper foil layer disposed on the insulating layer,
- a first plating layer disposed on the copper foil layer, and
- a second plating layer disposed on the first plating layer, and
- wherein the insulating layer includes a resin and a filler in the resin, and
- wherein a recess is provided at an inner wall of the via hole and has a shape corresponding to the filler.
7 more elements
Dependencies are inferred from the claim text.