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US 12,016,127 B2Granted
Liquid metal infiltration rework of electronic assembly
AssigneeInternational Business Machines Corporation
InventorsMark K. Hoffmeyer, Timothy P. Younger
Life of this patent
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Abstract
Provided is a method for removing an electronic component from a printed wiring board. The method comprises applying an embrittlement agent to a lead of an electronic component that is soldered to the printed wiring board. The electronic component is removed from the printed wiring board by breaking the embrittled lead.
Claims20
A system comprising:
- a memory;
- and
- a processor communicatively coupled to the memory, wherein the processor is configured to perform a method comprising:
- applying an embrittlement agent to a soldered joint of an electronic component that is soldered to a printed wiring board;
- and
- removing the electronic component from the printed wiring board by breaking the embrittled joint.
3 more elements
A system comprising:
- a memory;
- and
- a processor communicatively coupled to the memory, wherein the processor is configured to perform a method comprising:
- applying an embrittlement agent to a soldered joint of an electronic component that is soldered to a printed wiring board;
- heating the applied embrittlement agent to a temperature that meets or exceeds a reflow temperature of the embrittlement agent;
- holding the embrittlement agent at the temperature for an amount of time to allow the embrittlement agent to at least partially diffuse into the joint;
- and
- removing, after the embrittlement agent has at least partially diffused into the joint, the electronic component from the printed wiring board by breaking the embrittled joint,
- wherein the embrittlement agent comprises metal particles, wherein the metal particles include one or more particles selected from the group consisting of elemental copper, a copper alloy, elemental silver, a silver alloy, elemental antimony, and an antimony alloy.
6 more elements
Dependencies are inferred from the claim text.