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US 12,016,126 B2Granted
Carrier tape system and components and methods of use
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsSung-Sheng Chiu, Pei-Haw Tsao, Tsui-Mei Chen, Shih-Hsing Lin, Li-Huan Chu
Life of this patent
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Abstract
The current disclosure describes carrier tape systems, which include a cover tape having adhesion areas and non-adhesion areas which are substantially free of adhesive. Methods for supplying semiconductor devices to an apparatus, which in operation, places the semiconductor devices at desired locations are also described. Methods of forming a semiconductor device carrier system are also described.
Claims20
A carrier tape system for a semiconductor device, the carrier tape system comprising:
- a carrier tape including a plurality of pockets, each pocket including an opening through which a semiconductor device passes when the semiconductor device is placed in the pocket, the semiconductor device having a width dimension;
- and
- a cover tape including a cover tape base material and an adhesive layer on the cover tape base material, the adhesive layer including a plurality of adhesion areas consisting of adhesive on the cover tape base material and a plurality of discontinuous non-adhesion areas along a length of the cover tape base material, the discontinuous non-adhesion layers including adhesive on the cover tape base material and a material that is not sticky over the adhesive on the cover tape base material, wherein the plurality of adhesion areas encompass respective ones of the plurality of non-adhesion areas and wherein each of the plurality of non-adhesion areas are spaced from each other along the length of the cover tape base material and correspond to a portion of the cover tape that covers an opening of a pocket of the plurality of pockets, each of the plurality of non-adhesion areas facing a respective one of the plurality of pockets and each of the plurality of discontinuous non-adhesion areas has a width dimension or a diameter that is less than the width dimension of the semiconductor device.
A carrier tape system for a semiconductor device, the carrier tape system comprising:
- a carrier tape including a plurality of pockets, each pocket including an opening through which a semiconductor device passes when the semiconductor device is placed in the pocket, the semiconductor device having a width dimension;
- and
- a cover tape including a cover tape base material and an adhesive layer on the cover tape base material, the adhesive layer including a plurality of adhesion areas consisting of adhesive on the cover tape base material and a plurality of discontinuous non-adhesion areas along a length of the cover tape base material, the discontinuous non-adhesion areas including adhesive on the cover tape base material and a material overlying the adhesive on the cover tape base material that inhibits an adhesive from adhering to a semiconductor device when it is in the pocket, wherein the plurality of adhesion areas encompass respective ones of the plurality of non-adhesion areas-, are spaced from each other along the length of the cover tape base material and correspond to portions of the cover tape that cover respective openings of the plurality of pockets, each of the plurality of non-adhesion areas facing a respective one of the plurality of pockets and each of the plurality of discontinuous non-adhesion areas has a width dimension or a diameter that is less than the width dimension of the semiconductor device.
A carrier tape system for a semiconductor device, the carrier tape system comprising:
- a carrier tape including a plurality of pockets, each pocket including an opening through which a semiconductor device passes when the semiconductor device is placed in the pocket, the semiconductor device having a width dimension and each opening having a round shape and including a diameter dimension;
- and
- a cover tape including a cover tape base material and an adhesive layer on the cover tape base material, the adhesive layer including a plurality of adhesion areas consisting of adhesive on the cover tape base material and a plurality of discontinuous non-adhesion areas along a length of the cover tape base material, the discontinuous non-adhesion areas including either (1) portions of the adhesive layer covered by a material that inhibits the adhesive layer from adhering to a semiconductor device when it is in the pocket or (2) adhesive on the cover tape base material and a material that is not sticky over the adhesive on the cover tape base material, wherein the plurality of adhesion areas encompass respective ones of the plurality of non-adhesion areas and wherein each of the plurality of non-adhesion areas are round, have a diameter dimension that is less than the width dimension of the semiconductor device, are spaced from each other along the length of the cover tape base material and corresponds to portions of the cover tape that cover a respective opening of a pocket of the plurality of pockets, each of the plurality of non-adhesion areas facing a respective one of the plurality of pockets.
Dependencies are inferred from the claim text.