Protective enclosure for an electronic device

A manufacturing method, comprising:

• attaching a printed-circuit-board assembly to a base, the printed-circuit-board assembly comprising a printed circuit board and a plurality of electronic components attached to the printed circuit board;
• forming a sub-assembly by attaching a heat spreader to a lid, the heat spreader being a stamped sheet-metal part having a plurality of legs, each of the legs being fixedly attached to an inner main surface of the lid;
• depositing one or more drops of a fluid thermal-interface material onto the subassembly;
• and
• attaching the subassembly to the base to enclose the printed-circuit-board assembly therebetween such that each of the one or more drops is in contact with and vertically between the heat spreader and a corresponding one of the electronic components,
• wherein the stamped sheet-metal part is shaped such that after the attaching:
• a first flat portion of the stamped sheet-metal part facing the inner main surface of the lid is at a first nonzero vertical distance from the inner main surface and is parallel to the inner main surface;
• and
• a second flat portion of the stamped sheet-metal part facing the inner main surface of the lid is at a second vertical distance from the inner main surface and is parallel to the inner main surface, the second vertical distance being larger than the first nonzero vertical distance.