Electronic device with active heat transfer

A method of transferring heat away from a front surface of an electronic device and dissipating the heat through a back surface of the electronic device opposite the front surface, the method comprising:

• receiving the heat generated by a heat source at a first portion of a heat pipe on a first side of the heat source, the heat pipe wrapping partially around the heat source and including a second portion on a second side of the heat source opposite the first side;
• transferring the heat from the second portion of the heat pipe to a first surface of an active heat transfer device;
• conducting the heat through a second surface of the active heat transfer device opposite the first surface;
• and
• dissipating, with a first passive heat transfer element coupled to or embedded within a plate that at least partially defines a back surface of the electronic device, the heat conducted through the second surface of the active heat transfer device through the back surface of the electronic device.

A cooling system, comprising:

• a heat pipe adapted to extend along three sides of a heat source, the heat pipe including a first portion positioned on a first side of the heat source and a second portion adapted to be positioned on a second side of the heat source opposite the first side, the first portion of the heat pipe adapted to absorb heat from the first side of the heat source;
• an active heat transfer device positioned adjacent to the second portion of the heat pipe, the active heat transfer device being adapted to absorb the heat through a first surface facing the heat pipe and release the heat through a second surface opposite the first surface;
• and
• a first passive heat transfer element adjacent to the second surface of the active heat transfer device, the first passive heat element being coupled to or embedded within a plate that dissipates the heat and that at least partially defines a back surface of an electronic device.