Dual phase clock distribution from a single source in a die-to-die interface

A method for transmitting data using a die-to-die interface, the method comprising:

• generating a local clock signal at a first die;
• generating a strobe signal at the first die, the strobe signal having a phase offset from the local clock signal;
• transmitting the strobe signal from the first die to a second die via a strobe subset of connection paths;
• and
• transmitting, based on the local clock signal, data signals from the first die to the second die via a data subset of connection paths, wherein:
• the first die comprises a first plurality of connection points;
• the second die comprises a second plurality of connection points;
• and
• each connection point of the first plurality of connection points is coupled to a corresponding connection point of the second plurality of connection points through a connection path, each connection path comprising a substantially same length, and is included in one of:
• the data subset of connection paths for transmitting data from the first die to the second die based on the local clock signal and the strobe subset of connection paths for transmitting the strobe signal from the first die to the second die.

A semiconductor die comprising:

• a phase locked loop and a transmit block, the transmit block comprising a first plurality of connection points, and a first plurality of connection segments, wherein:
• the phase locked loop is configured to output a local clock signal and to output a strobe signal having a phase offset relative to the local clock signal;
• the local clock signal and the first strobe signal are routed to the first transmit block;
• and
• each of the first connection segments is coupled to one of the first plurality of connection points and is further configured to form a connection path by coupling to one of a second plurality of connection segments of a second die, each of the second plurality of connection segments coupled to one of a second plurality of connection points of the second die, wherein each connection path has a substantially same length.