Laser module and electronic device
AssigneeVivo Mobile Communication Co., Ltd.
InventorFeng Zhou
Life of this patent
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Abstract
A laser module includes an optical assembly, a laser chip disposed on a side of the optical assembly, a power supply structure, a packaging structure and a heat dissipation structure. The power supply structure includes a first electrode and a second electrode both connected to the laser chip. An accommodating cavity is formed in the packaging structure, and the optical assembly is at least partially received in the accommodating cavity. The heat dissipation structure is sleeved on an outer side of the packaging structure, and abuts against the first electrode and the second electrode.
Claims14
A laser module, comprising:
- an optical assembly;
- a laser chip, disposed on a side of the optical assembly;
- a power supply structure, comprising a first electrode and a second electrode, wherein the first electrode and the second electrode are both connected to the laser chip;
- a packaging structure in which an accommodating cavity is formed, wherein the optical assembly is at least partially received in the accommodating cavity;
- and
- a heat dissipation structure, sleeved on an outer side of the packaging structure, wherein the heat dissipation structure abuts against the first electrode and the second electrode;
- the heat dissipation structure comprises a heat dissipation body and a heat conductor, wherein the heat dissipation body is sleeved on the outer side of the packaging structure, one side of the heat conductor abuts against the heat dissipation body, and another side of the heat conductor abuts against the first electrode and the second electrode;
- and
- the heat dissipation body comprises a substrate and an extension piece, wherein the substrate is sleeved on the outer side of the packaging structure, the substrate comprises a first end and a second end opposite to and facing away from each other, the first end abuts against the heat conductor, the second end is connected to the extension piece, and the extension piece is located on a side of the optical assembly away from the laser chip.
An electronic device, comprising a laser module, wherein the laser module comprises:
- an optical assembly;
- a laser chip, disposed on a side of the optical assembly;
- a power supply structure, comprising a first electrode and a second electrode, wherein the first electrode and the second electrode are both connected to the laser chip;
- a packaging structure in which an accommodating cavity is formed, wherein the optical assembly is at least partially received in the accommodating cavity;
- and
- a heat dissipation structure, sleeved on an outer side of the packaging structure, wherein the heat dissipation structure abuts against the first electrode and the second electrode;
- the heat dissipation structure comprises a heat dissipation body and a heat conductor, wherein the heat dissipation body is sleeved on the outer side of the packaging structure, one side of the heat conductor abuts against the heat dissipation body, and another side of the heat conductor abuts against the first electrode and the second electrode;
- and
- the heat dissipation body comprises a substrate and an extension piece, wherein the substrate is sleeved on the outer side of the packaging structure, the substrate comprises a first end and a second end opposite to and facing away from each other, the first end abuts against the heat conductor, the second end is connected to the extension piece, and the extension piece is located on a side of the optical assembly away from the laser chip.
Dependencies are inferred from the claim text.