Antenna-on-package integrated circuit device

An integrated circuit package comprising:

• an antenna substrate including a first dielectric layer, and a plurality of conductor layers including a first conductor layer, a transmitter antenna formed by the first conductor layer, a receiver antenna formed by the first conductor layer, a second conductor layer disposed on a first side of the first dielectric layer and a third conductor layer disposed on a second side of the first dielectric layer, the second side being opposite the first side;
• an electromagnetic bandgap structure formed in part by the first, second and third conductor layers, a portion of the electromagnetic bandgap structure that is formed by the first conductor layer being disposed between the transmitter antenna and the receiver antenna;
• an I/O substrate including a second dielectric layer and a second set of package connectors disposed on the second dielectric layer;
• a first set of package connectors that physically and electrically couple the antenna substrate to the I/O substrate;
• and
• an integrated circuit die disposed alongside the first set of package connectors;
• wherein the integrated circuit die and the first set of package connectors are positioned between the antenna substrate and the I/O substrate;
• wherein the integrated circuit die includes a bond pad positioned on a first side of the integrated circuit die, and the bond pad is coupled to the second side of the first dielectric layer;
• wherein the bond pad is electrically connected to the first conductor layer;
• wherein the antenna substrate is coupled to the first side of the integrated circuit die;
• wherein the first dielectric layer positioned between the integrated circuit die and the first conductor layer that forms the transmitter antenna and the receiver antenna;
• and
• wherein the second dielectric layer is positioned between the second set of the package connectors and the integrated circuit die.