Bonding method, display backplane and system for manufacturing display backplane

A display backplane, comprising:

• a plurality of first metal bumps;
• a TFT substrate, wherein the plurality of first metal bumps are transferred to the TFT substrate and the plurality of first metal bumps are eutectically bonded to metal pad blocks on the TFT substrate;
• and
• a plurality of LED flip chips, wherein the plurality of LED flip chips are transferred to the TFT substrate, and the plurality of LED flip chips are eutectically bonded to the plurality of first metal bumps on the TFT substrate respectively;
• wherein each of the plurality of first metal bumps comprises a first metal layer, a second metal layer and a third metal layer;
• wherein the first metal layer is eutectically bonded to one of the metal pad blocks, the second metal layer is arranged on the first metal layer, and the third metal layer is arranged on the second metal layer.

A system for manufacturing a display backplane, comprising:

• a substrate, wherein the substrate comprises a plurality of first metal bumps;
• a TFT substrate, wherein a plurality of metal pad blocks is set on the TFT substrate;
• a plurality of LED flip chips;
• and
• a transfer device, wherein the transfer device is used for transferring the plurality of first metal bumps to the TFT substrate so as to eutectically bond the plurality of first metal bumps to the metal pad blocks on the TFT substrate;
• and
• the transfer device is further used for transferring the plurality of LED flip chips to the TFT substrate, such that the plurality of LED flip chips are eutectically bonded to the plurality of first metal bumps on the TFT substrate separately;
• wherein each of the plurality of first metal bumps comprises a first metal layer, a second metal layer and a third metal layer;
• wherein the first metal layer is eutectically bonded to one of the metal pad blocks, the second metal layer is arranged on the first metal layer, and the third metal layer is arranged on the second metal layer.