Chip scale light-emitting diode package and manufacturing method thereof

A method of manufacturing a chip scale light- emitting diode package, the method comprising:

• manufacturing a lens molding sheet having intaglios on one surface thereof;
• forming a lens layer having lens portions on one surface thereof and a flat surface on a surface opposite thereto by applying a light-transmitting resin to the intaglios;
• forming an adhesive layer on the flat surface of the lens layer;
• arranging, on the adhesive layer, light-emitting diode chips each having a first surface, on which a first electrode pad and a second electrode pad are formed, and a second surface opposite to the first surface, in such a way that the light-emitting diode chips correspond to the lens portions and the second surface is attached to the adhesive layer;
• and
• manufacturing a chip array sheet by forming a molding part on the adhesive layer to cover outer surfaces of the light-emitting diode chips,
• wherein the adhesive layer includes a first adhesive film attached to the lens layer and a second adhesive film attached to the light-emitting diode chips, and a wavelength conversion material is disposed between the first adhesive film and the second adhesive film.