Integrated assemblies and methods of forming integrated assemblies
AssigneeMicron Technology, Inc.
InventorsYoshitaka Nakamura, Yi Fang Lee, Jerome A. Imonigie, Scott E. Sills, Aaron Michael Lowe
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AssigneeMicron Technology, Inc.
InventorsYoshitaka Nakamura, Yi Fang Lee, Jerome A. Imonigie, Scott E. Sills, Aaron Michael Lowe
Estimating the term…
Some embodiments include an integrated assembly having an access device between a storage element and a conductive structure. The access device has channel material which includes semiconductor material. The channel material has a first end and an opposing second end, and has a side extending from the first end to the second end. The first end is adjacent the conductive structure, and the second end is adjacent the storage element. Conductive gate material is adjacent the side of the channel material. A first domed metal-containing cap is over the conductive structure and under the channel material and/or a second domed metal-containing cap is over the channel material and under the storage element. Some embodiments include methods of forming integrated assemblies.
An integrated assembly comprising an access device between a storage element and a conductive structure;
A device comprising:
Dependencies are inferred from the claim text.