Metal-insulator-metal (MIM) capacitor module including a cup-shaped structure with a rounded corner region

An integrated circuit structure, comprising:

• an interconnect structure comprising:
• a lower interconnect element;
• an upper interconnect element;
• and
• an interconnect via between the lower interconnect element and the upper interconnect element, and
• a metal-insulator-metal (MIM) capacitor module comprising:
• a bottom electrode cup including:
• a laterally-extending bottom electrode cup base;
• and
• a bottom electrode cup sidewall extending upwardly from the laterally-extending bottom electrode cup base;
• an insulator including:
• an insulator cup formed in an opening defined by the bottom electrode cup;
• and
• a rounded insulator flange extending laterally outwardly and curving upwardly from the insulator cup, the rounded insulator flange covering an upper surface of the bottom electrode cup sidewall;
• a top electrode formed in an opening defined by the insulator cup;
• wherein the top electrode is insulated from the upper surface of the bottom electrode cup sidewall by the rounded insulator flange;
• and
• wherein the top electrode has a planarized top surface;
• a top electrode connection pad formed on a planarized top surface of the top electrode and fully covering the planarized top surface of the top electrode;
• and
• wherein the bottom electrode cup and the interconnect via are formed in a common dielectric region.

A metal-insulator-metal (MIM) capacitor module, comprising:

• a bottom electrode base;
• a bottom electrode cup, including:
• a laterally-extending bottom electrode cup base formed on the bottom electrode base;
• and
• a bottom electrode cup sidewall extending upwardly from the laterally-extending bottom electrode cup base;
• an insulator including:
• an insulator cup formed in an opening defined by the bottom electrode cup;
• and
• a rounded insulator flange extending laterally outwardly and curving upwardly from the insulator cup, the rounded insulator flange covering an upper surface of the bottom electrode cup sidewall;
• a top electrode formed in an opening defined by the insulator cup;
• wherein the top electrode is insulated from the upper surface of the bottom electrode cup sidewall by the rounded insulator flange;
• a bottom electrode contact spaced laterally apart from the bottom electrode cup, the bottom electrode contact conductively connected to the bottom electrode base;
• and
• a bottom electrode connection pad formed over the bottom electrode contact and conductively connected to the bottom electrode contact.