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US 12,015,044 B2Granted
Image sensor module and camera module including the same
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorKang Jin Lee
Life of this patent
Estimating the term…
Abstract
An image sensor module includes an image sensor and a substrate on which the image sensor is disposed, wherein a step portion is provided on an upper surface of the substrate, an accommodation portion in which the image sensor is disposed is provided at the step portion, the image sensor is connected to the substrate by a bonding wire, and the bonding wire is covered with a bonding portion.
Claims17
An image sensor module comprising:
- an image sensor;
- and
- a substrate on which the image sensor is disposed,
- wherein a step portion is provided on an upper surface of the substrate,
- wherein an accommodation portion in which the image sensor is disposed is provided at the step portion,
- wherein the image sensor is connected to the substrate by a bonding wire,
- wherein the bonding wire is covered with a bonding portion,
- wherein an inclined surface is disposed on the step portion, and a bonding pad provided at the step portion is disposed on the inclined surface, and
- wherein an upper surface of the step portion is disposed lower than an upper surface of the image sensor in an optical axis direction.
6 more elements
An image sensor module comprising:
- an image sensor;
- and
- a substrate on which the image sensor is disposed,
- wherein a step portion is provided on an upper surface of the substrate,
- wherein an accommodation portion in which the image sensor is disposed is provided at the step portion,
- wherein the image sensor is connected to the substrate by a bonding wire,
- wherein the bonding wire is covered with a bonding portion,
- wherein the bonding portion covers a bonding pad provided at the image sensor and a bonding pad provided at the step portion,
- wherein the bonding pad provided at the step portion is disposed in a position lower than that of the bonding pad provided at the image sensor in an optical axis direction,
- wherein an inclined surface is disposed on the step portion, and the bonding pad provided at the step portion is disposed on the inclined surface, and
- wherein an upper surface of the step portion is disposed lower than an upper surface of the image sensor in an optical axis direction.
8 more elements
An image sensor module comprising:
- a substrate comprising an accommodation portion and a step portion;
- an image sensor disposed in the accommodation portion;
- a bonding wire connected to the substrate in the step portion and connected to the image sensor;
- and
- a bonding portion disposed on the bonding wire,
- wherein an upper surface of the step portion is disposed lower than an upper surface of the image sensor in an optical axis direction, and
- wherein an inclined surface is disposed on the step portion, and a bonding pad provided at the step portion is disposed on the inclined surface.
4 more elements
Dependencies are inferred from the claim text.