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US 12,015,043 B2Granted
Packaging structure, electronic device, and method for manufacturing the packaging structure
AssigneeTriple Win Technology(Shenzhen) Co. Ltd.
InventorHsin-Yen Hsu
Life of this patent
Estimating the term…
Abstract
A packaging structure for an image sensor used in an electronic device includes a flexible circuit board, a reinforcing plate, an image sensor, and an adhesive layer. The reinforcing plate is disposed on the flexible circuit board. The image sensor is disposed in the reinforcing plate. The adhesive layer bonds the flexible circuit board, the reinforcing plate, the image sensor and the conductor.
Claims11
A packaging structure comprising:
- a flexible circuit board comprising a first opening and a protruding portion surrounding the first opening;
- a reinforcing plate disposed on the flexible circuit board, the reinforcing plate comprising a second opening connected to the first opening, and the protruding portion protruding from a periphery of the second opening toward a center axis of the second opening;
- a conductor;
- an image sensor comprising a photosensitive area and a connecting area surrounding the photosensitive area, the image sensor disposed in the second opening, the connecting area and the protruding portion spaced apart from each other, the conductor electrically connecting the protruding portion to the protruding portion, the photosensitive area exposed from the first opening;
- and
- an adhesive layer bonding together the protruding portion, the reinforcing plate, the connecting area, and the conductor, the adhesive layer disposed between a periphery of the image sensor and an inner sidewall of the second opening of the reinforcing plate, and the adhesive layer further covering the conductor.
3 more elements
An electronic device comprising:
- a packaging structure comprising:
- a flexible circuit board comprising a first opening and a protruding portion surrounding the first opening;
- a reinforcing plate disposed on the flexible circuit board, the reinforcing plate comprising a second opening connected to the first opening, and the protruding portion protruding from a periphery of the second opening toward a center axis of the second opening;
- a conductor;
- an image sensor comprising a photosensitive area and a connecting area surrounding the photosensitive area, the image sensor disposed in the second opening, the connecting area and the protruding portion spaced apart from each other, the conductor electrically connecting the protruding portion to the protruding portion, the photosensitive area exposed from the first opening;
- and
- an adhesive layer bonding together the protruding portion, the reinforcing plate, the connecting area, and the conductor, the adhesive layer disposed between a periphery of the image sensor and an inner sidewall of the second opening of the reinforcing plate, and the adhesive layer further covering the conductor.
4 more elements
Dependencies are inferred from the claim text.