Solid-state imaging device, method of manufacturing the same, and electronic apparatus capable to protect a photoelectric conversion film

An electronic apparatus, comprising:

• a solid-state imaging device including:
• a semiconductor substrate;
• a photoelectric conversion film on an upper side of the semiconductor substrate;
• a first sealing film above the photoelectric conversion film;
• a second sealing film above the first sealing film, wherein the second sealing film includes a first layer and a second layer;
• a third sealing film between the first sealing film and the second sealing film, wherein
• the first layer of the second sealing film is under the third sealing film,
• the second layer of the second sealing film is on the third sealing film,
• the first layer of the second sealing film covers an entire lower surface of the third sealing film,
• the second layer of the second sealing film covers an entire upper surface of the third sealing film,
• the first layer of the second sealing film is on the first sealing film, and
• the first layer of the second sealing film is thinner than the second layer of the second sealing film;
• and
• a light shielding film between the first sealing film and the first layer of the second sealing film, wherein
• the light shielding film is on the first sealing film, and
• each of the first layer of the second sealing film, the second layer of the second sealing film, and the third sealing film is on the light shielding film.