Integrated circuit package and method of forming same

A package comprising:

• a substrate;
• a first integrated circuit die bonded to a first side of the substrate;
• a second integrated circuit die bonded to the first side of the substrate adjacent the first integrated circuit die;
• an annular structure bonded to the first side of the substrate adjacent the second integrated circuit die;
• a first encapsulant over the substrate and surrounding the annular structure, the first integrated circuit die and the second integrated circuit die, wherein a topmost surface of the first encapsulant is level with a topmost surface of the annular structure, a topmost surface of the first integrated circuit die and a topmost surface of the second integrated circuit die;
• a functional component within the annular structure and bonded to the first side of the substrate;
• and
• a second encapsulant within the annular structure and extending along sidewalls of the functional component.

A package comprising:

• a substrate;
• a first integrated circuit die bonded to a first side of the substrate;
• a second integrated circuit die bonded to the first side of the substrate adjacent the first integrated circuit die;
• an annular structure bonded to a topmost surface of the substrate;
• a first encapsulant over the substrate and surrounding the annular structure, the first integrated circuit die and the second integrated circuit die, wherein a topmost surface of the first encapsulant is level with a topmost surface of the annular structure and a topmost surface of the second integrated circuit die;
• a functional component within the annular structure and bonded to the first side of the substrate, wherein the annular structure is between the first encapsulant and the functional component;
• and
• a second encapsulant within the annular structure and extending along sidewalls of the functional component.