Semiconductor package with multiple redistribution substrates

A method of manufacturing semiconductor package, comprising:

• forming a first redistribution substrate;
• forming a second redistribution substrate in another space different from a space in which the first redistribution substrate is formed, the second redistribution substrate comprising a connection terminal formed on a bottom surface thereof;
• forming a conductive structure on the first redistribution substrate;
• mounting a first semiconductor chip on the first redistribution substrate, the first semiconductor chip being spaced apart from the conductive structure in a first direction;
• forming a first molding layer covering the first semiconductor chip and the conductive structure;
• disposing an adhesive film on the first molding layer;
• and
• attaching the second redistribution substrate on the adhesive film,
• wherein the adhesive film comprises conductive particles and the connection terminal therein,
• wherein attaching the second redistribution substrate on the adhesive film comprises:
• aligning the connection terminal to vertically overlap the conductive structure;
• applying pressure on a top surface of the second redistribution substrate;
• and
• applying heat to the adhesive film,
• wherein the connection terminal comprises a first part and a second part that surrounds a lower portion of the first part after applying heat to the adhesive film,
• wherein a maximum width of the first part of the connection terminal is less than a width of the conductive structure, and
• wherein a maximum width of the second part of the connection terminal is equal to the width of the conductive structure.