US 12,015,015 B2 · Semiconductor package and semiconductor module including the same

Abstract

A semiconductor package includes a substrate including a first bonding pad and a first conductive pattern positioned at the same level and in contact with the first bonding pad; a lower semiconductor chip and an upper semiconductor chip stacked over the substrate, the lower and upper semiconductor chips respectively including a first lower chip pad and a first upper chip pad; a first lower bonding wire with first and second ends respectively connected to the first bonding pad and the first lower chip pad; and a first upper bonding wire with a first end connected to the first bonding pad and a second end connected to the first upper chip pad, the first end of the first upper bonding wire is located farther from the lower and upper semiconductor chips and closer to the first conductive pattern than the first end of the first lower bonding wire.

Claims18

Dependent claims

A semiconductor package comprising:

a substrate including a first bonding pad and a first conductive pattern, wherein the first bonding pad is in contact with the first conductive pattern;
a lower semiconductor chip stacked over the substrate, wherein the lower semiconductor chip includes a first lower chip pad;
an upper semiconductor chip stacked over the lower semiconductor chip, wherein the upper semiconductor chip includes a first upper chip pad;
a first lower bonding wire connecting the first bonding pad to the first lower chip pad;
and
a first upper bonding wire connecting the first bonding pad to the first upper chip pad,
wherein the first bonding pad is positioned between the first conductive pattern and the first semiconductor chip,
wherein the first lower bonding wire is connected to a first portion of the first bonding pad and the first upper bonding wire is connected to a second portion of the first bonding pad, and
wherein the first portion of the first bonding pad is farther from the first conductive pattern than the second portion of the first bonding pad.

6 more elements

A semiconductor module comprising:

a module substrate;
a semiconductor package stacked over the module substrate;
a package substrate including a first bonding pad exposed on a top surface of the package substrate and a first conductive via formed within the package substrate;
a semiconductor chip stack stacked over the package substrate, wherein the semiconductor chip stack includes a first chip pad and a second chip pad,
a first bonding wire electrically connecting the first bonding pad to the first chip pad;
and
a second bonding wire electrically connecting the first bonding pad to the second chip pad,
wherein the first bonding wire is bonded to a first portion of the first bonding pad,
wherein the second bonding wire is bonded to a second portion of the first bonding pad,
wherein a first length of the first bonding wire is shorter than a second length of the second bonding wire, and
wherein a first distance between the first conductive via and the first portion of the first bonding pad is longer than a second distance between the first conductive via and the second portion of the first bonding pad.

8 more elements

Dependencies are inferred from the claim text.

Semiconductor package and semiconductor module including the same

Life of this patent

Semiconductor package and semiconductor module including the same

Life of this patent

Abstract

Claims18