Semiconductor device and method of manufacturing the same

A semiconductor device comprising:

• a substrate;
• a semiconductor element configured to face the substrate in a direction normal to the substrate, the direction being a normal direction of the substrate and corresponding to a normal line of the substrate;
• and
• a tin-based solder layer configured to join the semiconductor element to the substrate,
• wherein the tin-based solder layer includes a central portion and a peripheral portion surrounding the central portion in a view of the normal direction,
• wherein the tin-based solder layer has a tin crystal with a C-axis, and the C-axis is at each of the central portion and the peripheral portion,
• wherein the C-axis at the central portion intersects the normal line at an angle larger than 45 degrees with respect to the normal line, and
• wherein the C-axis at the peripheral portion either intersects the normal line at an angle smaller than or equal to 45 degrees with respect to the normal line, or is parallel to the normal line.