Semiconductor package including non-conductive film and method for forming the same

A semiconductor package, comprising:

• a substrate;
• a plurality of semiconductor chips on the substrate, each semiconductor chip of the plurality of semiconductor chips including
• an active region, and
• a scribe lane in continuity with an edge of the active region;
• a plurality of non-conductive films (NCFs) among the plurality of semiconductor chips and between the substrate and the plurality of semiconductor chips;
• and
• a plurality of connecting members among the plurality of semiconductor chips and between the substrate and the plurality of semiconductor chips, the plurality of connecting members being connected to the substrate and the plurality of semiconductor chips while extending in the plurality of non-conductive films (NCFs),
• wherein each non-conductive film (NCF) of the plurality of non-conductive films (NCFs) at least partially defines a separate recess region of a plurality of recess regions overlapping with at least one scribe lane of the scribe lanes of the plurality of semiconductor chips in plan view and extending onto at least one active region of the active regions of the plurality of semiconductor chips.

A semiconductor package comprising:

• a first substrate;
• a first semiconductor package on the first substrate;
• and
• a second semiconductor package on the first substrate and electrically connected to the first semiconductor package,
• wherein the first semiconductor package includes
• a second substrate,
• a plurality of semiconductor chips on the second substrate, each semiconductor chip of the plurality of semiconductor chips including
• an active region, and
• a scribe lane in continuity with an edge of the active region,
• a plurality of non-conductive films (NCFs) among the plurality of semiconductor chips and between the second substrate and the plurality of semiconductor chips, and
• a plurality of connecting members among the plurality of semiconductor chips and between the second substrate and the plurality of semiconductor chips, the plurality of connecting members being connected to the second substrate and the plurality of semiconductor chips while the extending within the plurality of non-conductive films (NCFs),
• wherein each non-conductive film (NCF) of the plurality of non-conductive films (NCFs) at least partially defines a separate recess region overlapping with at least one scribe lane of the scribe lanes of the plurality of semiconductor chips in plan view and extending onto at least one active region of the active regions of the plurality of semiconductor chips.