Integration and bonding of micro-devices into system substrate
AssigneeVueReal Inc.
InventorsGholamreza Chaji, Bahareh Sadeghimakki
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Abstract
This disclosure is related to integrating optoelectronics microdevices into a system substrate for efficient and durable electrical bonding between two substrates at low temperature. 2D nanostructures and 3D scaffolds may create interlocking structures for improved bonding properties. Addition of nanoparticles into the structure creates high surface area for better conduction. Application of curing agents before or after alignment of micro devices and receiving substrates further assists with formation of strong bonds.
Claims18
A method of electrically bonding a microdevice into a receiver substrate, the method comprising:
- bonding at least a part of one surface of at least one bonding pad on a receiver substrate to at least a part of another surface of at least an optoelectronic microdevice on a donor substrate,
- covering a gap between the at least one bonding pad and the at least one optoelectronic microdevice with a nanowire,
- coating the nanowire with a bonding material to decrease a resistance of the nanowire, and
- applying a current to the at least one boding pad to decrease the contact resistance.
Dependencies are inferred from the claim text.